恒峰g22

Versatile-GB310 is an automatic large-format Panel precision thinning machine independently developed by Hwatsing , targeting advanced board-level and panel-level packaging processes such as Fan-out, 2.5D/3D packaging, high-density substrates, and display panels, filling the gap in domestic mass-production equipment for large-board precision grinding. It accommodates a wide range of large-format, flexible, and brittle panels, including resin substrates, ultra-large PCB boards, display panels, and optical glass panels, supporting high-precision controlled material removal, uniform thinning, and low-damage processing. Through a fully automated material handling system and closed-loop process control, the equipment enables fully unattended operation covering loading, high-precision alignment, controlled grinding and thinning, double-side cleaning, and air-drying unloading. Leveraging a proprietary high-precision grinding algorithm and a high-rigidity machine structure, it delivers excellent full-area thickness uniformity control and ultra-low surface roughness, effectively suppressing common issues in large-panel grinding such as warpage, deformation, thickness deviation, edge chipping, and subsurface damage, thereby significantly improving the yield and consistency of ultra-thin substrate processing. The equipment also supports rapid switching of process recipes according to material hardness, target thinning amount, and precision level, accommodating multi-variety mixed-line mass production; a single unit can cover multiple panel thinning scenarios, notably reducing equipment investment, floor space, and maintenance costs. It provides core equipment support for the large-scale production of advanced processes such as high-end board-level packaging, heterogeneous integration, and ultra-thin substrate fabrication, contributing to the self-sufficiency and domestic upgrading of packaging and testing production lines.