恒峰g22

Versatile-DC300 is a dedicated fully automated ring cutting system engineered for 12-inch wafers after backside thinning with ring retention. Targeting critical pain points such as wafer cracking and inconsistent ring removal in thin-wafer processing, Versatile-DC300 integrates a fully automated ring removal mechanism with drop detection — enabling precise identification and immediate alerting of pick-up anomalies. An inline UV debonding module completes debonding in one seamless step. The cutting system features an automatic blade dressing unit to maintain optimal blade sharpness, paired with real-time blade breakage detection that triggers an immediate protective shutdown upon anomaly identification — eliminating batch-level cutting defects at the source. Downstream, fully automated wafer transfer links seamlessly to cleaning and spin-drying stations, ensuring contactless, contamination-free wafer handling post ring cutting. With its fully automated, high-reliability, and mistake-proof design, Versatile-DC300 delivers a safe and efficient end-to-end solution for 12-inch thin-wafer ring cutting processes.