Versatile-DT150 is a high-performance, fully automated edge trimming system engineered for 4-inch (100mm) and 6-inch (150mm) wafers.The core dicing system supports both flat and round wafer profiles, with an adaptive algorithm that precisely handles complex contour transitions to ensure edge trimming consistency across non-standard geometries. A high-resolution visual alignment module enables inline closed-loop metrology with real-time feedback, closing the loop between cutting and quality control within a single station. The fully automated wafer handling system offers flexible multi-size compatibility with precise, reliable transfer control — significantly reducing wafer breakage risk and manual intervention. With its high-efficiency, compact, and precision-driven design, Versatile-DT150 delivers a turnkey edge trimming solution for small- to mid-size wafer manufacturing.
High performance and precision; compact design saves cleanroom space
Supports both flat and round edge cutting; adaptive algorithm precisely handles complex contour transitions
High-resolution vision alignment with in-station closed-loop measurement and real-time feedback
Fully automated wafer handling; multi-size compatible with precise and reliable transfer control