Versatile-DT300D is a fully automatic, dual-stage wafer edge trimming system designed for advanced memory and packaging applications, Its compact footprint is purpose-built for space-constrained cleanroom environments, delivering maximum throughput per unit area. Building on the proven Versatile-DT300 platform, it innovatively introduces a dual-stage system architecture that breaks through the efficiency bottleneck in cutting and metrology. While maintaining the same equipment footprint, it integrates cutting, wafer transfer, cleaning, and metrology into one system, significantly boosting WPH (Wafers Per Hour). Equipped with a multi-axis synchronized high-precision cutting module and a high-resolution visual metrology system, it precisely resolves edge chipping and subsurface cracks after wafer thinning, fully meeting the manufacturing requirements for DRAM, HBM, advanced packaging, and beyond.
Dual-stage parallel architecture, breaking through efficiency bottlenecks
High integration and space-optimized design
Multi-axis synchronized high-precision cutting + in-line visual metrology
Broad advanced process applicability