Versatile?GM300HC is a fully?automatic grind?polish?mounter integrated system developed for the advanced packaging field.Focused on full?sequence requirements for wafer back?side thinning, the equipment enables integrated processing of wafer back?side grinding, polishing, and tape mounting / detaping. It adopts separate?chamber operation for coarse polishing and fine polishing, and integrates a high?purity wet cleaning module, which greatly improves wafer cleanliness in standalone mode.The system supports both 8?inch and 12?inch wafer processing and offers two transfer configurations—clamping and vacuum chuck—to accommodate diverse process development needs in emerging fields such as advanced packaging and MEMS.
Combined rough grind, fine grind and wet polish processes offer superior surface quality
The matched high-cleanliness module enables front-end-level cleanliness for film-free wafers
Optional warped wafer transport kit supports high-warpage wafer processing in advanced packaging