The Master-P510 polishing equipment is a high-precision polishing device for panel-level products in fields such as advanced packaging and glass substrates, specifically designed to meet the ultra-planarization and low-defect polishing requirements of panels with dimensions not exceeding 510mm×515mm. Featuring a single polishing head and a single platen, it boasts low maintenance costs, flexible process switching, and no need for complex supporting facilities.
Polishing head with 5 independent pneumatic pressure zones
Multiple advanced endpoint detection technology integrated
Semi-automatic wafer loading/unloading
Equipped with offline cleaning unit, wet-in / dry-out