Versatile-DT300 is a high efficient and high clean fully automatic dual spindle wafer edge trimming equipment launched by Hwatsing. It is used to accurately solve the problem of edge chipping and breakage during wafer thinning and improve thinning quality. This equipment integrates multiple units such as cutting, transmission, cleaning, and measurement, and is equipped with multi-axis linkage high-precision cutting technology, fully automatic transmission, and high cleanliness cleaning technology. It is also equipped with high-resolution visual alignment and advanced measurement system. Versatile-DT300 has the advantages of high performance, compact size, flexible process, multi-mode combination, and multi-functional configuration, which greatly meets the technical needs of various wafer manufacturing processes and products such as Memory Chips, CMOS Image sensors, and Advanced packaging.
High performance and precision,compact design saves cleanroom space
Flexible process supporting single-axis, dual-axis, and angular cutting modes
High-resolution vision alignment with in-station closed-loop measurement and real-time feedback
Fully automated wafer handling with integrated high-cleanliness inline cleaning