Versatile-GM300 is an ultra-precision wafer grinding device innovatively developed for the packaging field. Featuring a compact layout, it supports both 8-inch and 12-inch wafers.It enables ultra?precision backside wafer grinding with stress relief and can be integrated with a wafer mounter as an inline system. The fully automated process covers precision thinning, cleaning and drying, tape-ring attachment, and back-tape detaping.The highly reliable wafer handling system effectively reduces the risk of thin-wafer breakage.Offering fine grinding (Finigrind),dry polishing and wet polishing(CMP) methods for stress removal,Versatile-GM300 delivers high precision, high rigidity, and exceptional process flexibility across a wide range of applications, fully meeting the demanding requirements of thin-wafer processing in the packaging field.
TTV<1.5um
Advanced thickness unifommity and surface defect contral technology
Inline integration with Mounter enables fully automatic workflow of ultra-precise thinning, stress remova
and taping/de-taping
Three stress-relief options to balance surface quality and throughput for varied product requirements